Samsung projects $200B Broadcom partnership by 2030

Samsung Electronics announced the signing of a memorandum of understanding with American company Broadcom, valued at over $200 billion, to expand collaboration in the fields of chip manufacturing, semiconductors, and advanced packaging technologies until 2030. The agreement aims to enhance Samsung's capabilities in producing custom chips for AI applications, particularly next-generation communication chips and manufacturing technologies below 2 nanometers, to support the high-performance computing market and compete with leading manufacturers like TSMC. This partnership comes at a time when demand for custom AI chips is increasing and reflects Samsung's focus on developing advanced technological solutions and establishing a leadership position in the semiconductor market.

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